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More About This Title Signal Integrity and Radiated Emission of High-Speed Digital Systems
English
This book provides an investigation into signal integrity (SI) and electromagnetic interference (EMI) problems. Topics such as reflections, crosstalk, switching noise and radiated emission (RE) in high-speed digital systems are covered, which are essential for IT and telecoms applications. The highly important topic of modelling is covered which can reduce costs by enabling simulation data to demonstrate that a product meets design specifications and regulatory limits. According to the new European EMC directive, this can help to avoid the expensive use of large semi-anechoic chambers or open area test sites for radiated emission assessments. Following a short introduction to signalling and radiated interference in digital systems, the book provides a detailed characterization of logic families in terms of static and dynamic characteristic useful for modelling techniques. Crosstalk in multi-coupled line structures are investigated by analytical, graphical and circuit-based methods, and techniques to mitigate these phenomena are provided. Grounding, filtering and shielding with multilayer PCBs are also examined and design rules given.
- Written by authors with extensive experience in industry and academia.
- Explains basic conceptual problems from a theoretical and practical point of view by using numerous measurements and simulations.
- Presents models for mathematical and SPICE-like circuit simulators.
- Provides examples of using full-wave codes for SI and RE investigations.
- Companion website containing lists of codes and sample material.
Signal Integrity and Radiated Emission of High-Speed Digital Systems is a valuable resource to industrial designers of information technology, telecommunication equipment and automation equipment as well as to development engineers. It will also be of interest to managers and designers of consumer electronics, and researchers in electronics.
English
Spartaco Caniggia was born in Venice, Italy, in 1948. He received his Laurea degree in electronic engineering from the University of Padua, in 1972. In 1975, after military service, he joined Siemens/Italtel, a telecommunication manufacturing company, where he was involved in various aspects of electrical phenomena in analog and digital devices, semiconductor development, and interconnection effects in high-speed ICs (Signal Integrity) for 30 years. He is now an EMC (Electromagnetic Compatibility) consultant.
Francescaromana Maradei is currently an Associate Professor at "La Sapienza" University. She joined the Department of Electrical Engineering of "La Sapienza" University, Rome in 1996 where, before becoming an Associate Professor, she had served as an Assistant Professor until 2000. She is the author of more than 80 papers in the field of numerical techniques and their application to EMC problems (shielding and transmission line analysis). For several years she has served as a reviewer of technical papers for the IEEE Transactions on Electromagnetic Compatibility, on Industry Applications, and on Magnetics.
English
1. Introduction to Signal Integrity and Radiated Emission in Digital System
2. High-Speed Digital Devices
3. Inductance
4. Capacitance
5. Reflection on Signal Lines
6. Crosstalk
7. Lossy Transmission Lines
8. Delta I-Noise
9. Radiated Emission from PCB
10. Grounding in PCB
11. Measurement and Modeling
12. Differential Signalling and Discontinuities Modeling in PCBs
Appendix A – Working Formulas for partial Inductance Calculation
Appendix B – Characteristic Impedance, Delay and Attenuation of Microstrips and Striplines
Appendix C - Computation of Resonances in Power Distribution Network of a PCB
Appendix D - Formulae for Simple-Radiating Structures
Appendix E - Introduction to Nodal Method for AC Analysis
Appendix F – Files in the Web
Index
English
“The approach and practical examples of this book make it a valuable tool for learners and professionals concerned with signal and power integrity and electromagnetic interference, including electrical engineers, system designers, and signal integrity engineers.” (International Journal Microstructure & Materials Properties, 2009)
