Modern Electroplating, Fourth Edition
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More About This Title Modern Electroplating, Fourth Edition
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MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada.
MILAN PAUNOVIC, PhD, is a researcher at IBM, T. J. Watson Research Center, Yorktown Heights, New York.
MILAN PAUNOVIC, PhD, is a researcher at IBM, T. J. Watson Research Center, Yorktown Heights, New York.
English
Fundamental Considerations. (M. Paunovic, et al.).
Electrodeposition of Copper (J. Dini).
Electrodeposition of Nickel (G. Di Bari).
Electrodeposition of Gold (P. Kohl).
Electroless and Electrodeposition of Silver (M. Schlesinger).
Tin and Tin Alloys for Lead-Free Solder (Y. Zhang & J. Abys).
Electrodeposition of Chromium (N. Mandich & D. Snyder).
Electrodeposition of Lead and Lead Alloys (M. Jordan).
Electrodeposition of Tin-Lead Alloys (M. Jordan).
Electrodeposition of Zinc and Zinc Alloys (R. Winand).
Electrodeposition of Iron and Iron Alloys (M. Izaki).
Electrodeposition of Palladium and Palladium Alloys (J. Abys & C. Dullaghan).
Nickel Alloys, Cobalt, and Cobalt Alloys (G. Di Bari).
Electrodeposition of Semiconductors, (T. Schlesinger).
Deposition on Nonconductors (M. Schlesinger).
Electrodeposition of Organic Films: Conductive Polymers (T. Osaka, et al.).
Electroless Deposition of Copper (M. Paunovic).
Electroless Deposition of Nickel (M. Schlesinger).
Electroless Deposition of Cobalt Alloy Films (T. Osaka, et al.).
Electroless Deposition of Palladium and Platinum (I. Ohno).
Electroless Deposition of Gold (Y. Okinaka & M. Kato).
Electroless Deposition of Alloys (I. Ohno).
Preparation for Deposition (D. Snyder).
Manufacturing Technologies (D. Turner).
Monitoring and Control (D. Turner).
Environmental Aspects of Electrodeposition (M. Tomkiewicz).
Appendix.
Index.
Electrodeposition of Copper (J. Dini).
Electrodeposition of Nickel (G. Di Bari).
Electrodeposition of Gold (P. Kohl).
Electroless and Electrodeposition of Silver (M. Schlesinger).
Tin and Tin Alloys for Lead-Free Solder (Y. Zhang & J. Abys).
Electrodeposition of Chromium (N. Mandich & D. Snyder).
Electrodeposition of Lead and Lead Alloys (M. Jordan).
Electrodeposition of Tin-Lead Alloys (M. Jordan).
Electrodeposition of Zinc and Zinc Alloys (R. Winand).
Electrodeposition of Iron and Iron Alloys (M. Izaki).
Electrodeposition of Palladium and Palladium Alloys (J. Abys & C. Dullaghan).
Nickel Alloys, Cobalt, and Cobalt Alloys (G. Di Bari).
Electrodeposition of Semiconductors, (T. Schlesinger).
Deposition on Nonconductors (M. Schlesinger).
Electrodeposition of Organic Films: Conductive Polymers (T. Osaka, et al.).
Electroless Deposition of Copper (M. Paunovic).
Electroless Deposition of Nickel (M. Schlesinger).
Electroless Deposition of Cobalt Alloy Films (T. Osaka, et al.).
Electroless Deposition of Palladium and Platinum (I. Ohno).
Electroless Deposition of Gold (Y. Okinaka & M. Kato).
Electroless Deposition of Alloys (I. Ohno).
Preparation for Deposition (D. Snyder).
Manufacturing Technologies (D. Turner).
Monitoring and Control (D. Turner).
Environmental Aspects of Electrodeposition (M. Tomkiewicz).
Appendix.
Index.
English
"...an excellent reference source for numerous plating methods." (IEEE Electrical Insulation Magazine, 2002)
