Title Details

Acknowledgements.

PART I: INTRODUCTION.

1. Introduction.

2. Micrometrology and Materials Characterization.

3. Simulation of Microfabrication Processes.

PART II: MATERIALS .

4. Silicon.

5. Thin-Film Materials and Processes.

6. Epitaxy.

7. Thin-film Growth and Structure.

PART III: BASIC PROCESSES.

8. Pattern Generation.

9. Optical Lithography.

10. Lithographic Patterns.

11. Etching.

12. Wafer Cleaning and Surface Preparation.

13. Thermal Oxidation.

14. Diffusion.

15. Ion Implantation.

16. CMP: Chemical-Mechanical Polishing.

17. Bonding and Layer Transfer.

18. Molding and Stamping.

PART IV: STRUCTURES.

19. Self-aligned Structures.

20. Plasma-etched Structures.

21. Wet-etched Structures.

22. Sacrificial Structures.

23. Structures by Deposition.

PART V: INTEGRATION.

24. Process Integration.

25. CMOS Transistor Fabrication.

26. Bipolar Technology.

27. Multilevel Metallization.

28. MEMS Process Integration.

29. Processing on Non-silicon Substrates.

PART VI: TOOLS.

30. Process for Microfabrication.

31. Tools for Hot Process.

32. Vacuum and Plasmas.

33. Tools for CVD and Epitaxy.

34. Integrated Processing.

PART VII: MANUFACTURING.

35. Cleanrooms.

36. Yield.

37. Wafer Fab.

PART VIII: FUTURE.

38. Moore's Law.

39. Microfabrication at Large.

Appendix A: Comments and Hints to Selected Problems.

Appendix B: Constants and Conversion Factors.

Index.