Handbook of Plasma Immersion Ion Implantation andDeposition
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More About This Title Handbook of Plasma Immersion Ion Implantation andDeposition

English

This is the first book to describe a family of plasma techniques used to modify the surface and near-surface layer of solid materials.

English

André Anders is a Senior Staff Scientist and the Leader of the Plasma Applications Group at Lawrence Berkeley National Laboratory, Berkeley, California. He grew up in East Germany and studied physics in Wroclaw, Poland, Berlin, Germany, and Moscow, Russia. He holds a doctorate degree in physics from Humboldt University, Berlin. From 1987 to 1991 he worked at the Academy of Sciences in East Berlin. After the fall of the Berlin Wall he moved to Berkeley, California, where he joint Berkeley Lab. He is the author of about 200 papers in refereed journals. Dr. Anders serves as an Officer/ Member on several internal conference committees and was elected Fellow of IEEE (USA) and Fellow of the Institute of Physics (UK). He also serves as a member of the Editorial Board of the journal Surface and Coatings Technology.

English

Introduction (J. Conrad).

FUNDAMENTALS.

Fundamentals of Plasmas and Sheaths (M. Lieberman).

Ion Implantation and Thin-Film Deposition (M. Nastasi, et al.).

Fundamentals of Plasma Immersion Ion Implantation and Deposition (B. Wood, et al.).

Materials Characterization and Testing Methods-A Brief Survey (K. Walter, et al.).

TECHNOLOGY.

Design of a PIII&D Processing Chamber (J. Matossian, et al.).

Plasma Sources (A. Anders, et al.).

Pulser Technology (D. Goebel, et al.).

Health and Safety Issues Related to PIII&D (D. Beals, et al.).

APPLICATIONS.

Nonsemiconductor Applications of PIII&D (K. Sridharan, et al.).

Semiconductor Applications (P. Chu, et al.).

Appendices.

Index.

English

"...provides a state-of-the-art survey of this important technology, and it will be welcomed by researchers and students in surface engineering, materials science, electrical engineering, and related fields." (E-Streams Vol. 4, No. 3, March 2001)
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